PRINTED CIRCUIT BOARD HAVING ALUMINUM TRACES WITH A SOLDERABLE LAYER OF MATERIAL OF APPLIED THERETO
摘要
A method is provided for producing a printed circuit board. The method includes the step of providing an insulating substrate having a layer of aluminum material applied to the substrate. A portion of the layer of aluminum material is removed for defining a circuit trace. A layer of conductive material is applied to the layer of aluminum material.
申请公布号
WO2011119558(A2)
申请公布日期
2011.09.29
申请号
WO2011US29355
申请日期
2011.03.22
申请人
LEAR CORPORATION;PITEL, JOSE ANTONIO, CUBERO;MONTSERRAT, ANDREU, FORES;EZQUERRA, MARIA LEONOR, TORRIJOS
发明人
PITEL, JOSE ANTONIO, CUBERO;MONTSERRAT, ANDREU, FORES;EZQUERRA, MARIA LEONOR, TORRIJOS