发明名称 |
SEMICONDUCTOR WAFER BONDING PRODUCT, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE |
摘要 |
<p>A semiconductor wafer bonding product according to the present invention includes: a semiconductor wafer; a transparent substrate provided at a side of a functional surface of the semiconductor wafer; a spacer provided between the semiconductor wafer and the transparent substrate; and a bonded portion continuously provided along a periphery of the semiconductor wafer, the transparent substrate being bonded to the semiconductor wafer through the bonded portion. It is preferred that a minimum width of the bonded portion is 50 pm or more.</p> |
申请公布号 |
SG173830(A1) |
申请公布日期 |
2011.09.29 |
申请号 |
SG20110060993 |
申请日期 |
2010.02.15 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
DEJIMA HIROHISA;KAWATA MASAKAZU;YONEYAMA MASAHIRO;TAKAHASHI TOYOSEI;SHIRAISHI FUMIHIRO;SATO TOSHIHIRO |
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