发明名称 CONDUCTIVE PASTE AND METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste low in possibility of occurrence of lift-off (peeling off from ceramic) when used in formation of an external electrode of a ceramic electronic component. SOLUTION: A sintering start temperature (°C) of conductive metal powder, and a glass transition point Tg(°C) of a glass frit are set to satisfy a relation (Tg of the glass frit)-(the sintering start temperature of the conductive metal powder) <100. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011192608(A) 申请公布日期 2011.09.29
申请号 JP20100059721 申请日期 2010.03.16
申请人 MURATA MFG CO LTD 发明人 KOGA SEISHI
分类号 H01B1/22;H01F27/29;H01G4/12;H01G4/30;H05K1/09 主分类号 H01B1/22
代理机构 代理人
主权项
地址