发明名称 PAD FOR TOUCH PANEL AND TOUCH PANEL USING SAME
摘要 The present invention relates to a pad for a touch panel and a touch panel using same. More particularly, the present invention relates to a pad for a touch panel and a touch panel using same, the pad for a touch panel including an insular layer with conductive patterns, wherein the insular layer has touch patterns and lead wires formed on the top surface thereof and connection electrodes, each of which is formed by one end of each of the lead wires extending to an edge of the insular layer. The pad for a touch panel comprises at the least: i) insulator layers with conductive patterns, including the insulator layer, a transparent conductive coating layer, which is laminated on a portion of the top surface of the insulator layer, and has the touch patterns, lead wires and connection electrode patterns thereon, and a metal coating layer, which is laminated on a portion of the top surface of the transparent conductive coating layer and has the lead wires and connection electrodes thereon; ii) an adhesive layer, which is laminated on the top surface of the top layer of the insulator layers with conductive patterns; and iii) a coupling layer, which is coupled to the top surface of the adhesive layer, wherein the connection electrode portion includes an opening portion, in which the top surface of the metal coating layer is open externally, and the opening portion includes a corrosion-resistant metal layer, which is coated on the opening portion in order to disconnect the opening portion from the outside. The present invention solves the problem of corrosion in the opening portion of the connection electrode portion, which enhances the durability of the touch panel, by using a corrosion-resistant metal to coat the opening portion of the connection electrode portion of the pad for a touch pad, the opening portion of the connection electrode portion being provided in order for the pad for a touch panel to be electrically connected to an external circuit board such as a FPCB.
申请公布号 WO2011118911(A2) 申请公布日期 2011.09.29
申请号 WO2011KR00999 申请日期 2011.02.16
申请人 TMAY CO., LTD.;PARK, JUN-YOUNG;JEONG, JOO-HYUN;JEONG, DAE-YOUNG;BAE, SANG-MO 发明人 PARK, JUN-YOUNG;JEONG, JOO-HYUN;JEONG, DAE-YOUNG;BAE, SANG-MO
分类号 G06F3/041;H01L21/027;H01L21/28 主分类号 G06F3/041
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