发明名称 Light emitting diode, method of manufacturing the same, light emitting diode package and lighting system including the same
摘要 A light emitting diode according to the embodiment includes a light emitting structure (145) including a first conductive semiconductor layer (130), an active layer (140) on the first conductive semiconductor layer, a second conductive semiconductor layer (150) on the active layer, a superlattice structure layer (160) on the second conductive semiconductor layer, and a third conductive semiconductor layer (170) on the superlattice structure layer; a light transmission electrode layer (190) on the light emitting structure; a first electrode (180) connected to the first conductive semiconductor layer; a second electrode (195) electrically connected to the light transmission electrode layer on the light emitting structure; and an insulating layer (120) extending from a lower portion of the second electrode to an upper portion of the second conductive semiconductor layer.
申请公布号 EP2369644(A2) 申请公布日期 2011.09.28
申请号 EP20110159571 申请日期 2011.03.24
申请人 LG INNOTEK CO., LTD. 发明人 HWANG, SUNG MIN
分类号 H01L33/14;F21K99/00;G02F1/13357;H01L33/04;H01L33/38;H01L33/42;H01L33/44;H01L33/46 主分类号 H01L33/14
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