发明名称 |
Connection structure, power module and method of manufacturing the same |
摘要 |
<p>In ultrasonic bonding of a metal terminal to a substrate pad, a thin buffer metal layer which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal and the pad upon bonding. This makes it possible to prevent abrasion and a crack in the pad at the end of the terminal caused by pressure and an ultrasonic wave upon the ultrasonic bonding. This makes it possible to realize a compact bonded structure with high reliability.</p> |
申请公布号 |
EP2219220(A3) |
申请公布日期 |
2011.09.28 |
申请号 |
EP20100000834 |
申请日期 |
2010.01.27 |
申请人 |
HITACHI AUTOMOTIVE SYSTEMS, LTD. |
发明人 |
IKEDA, UKYO;NAKAMURA, MASATO;YAMASHITA, SHIRO |
分类号 |
H01L23/498;H01L21/607 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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