Circuit assembly with an electric component and a compound film

摘要

The arrangement has an electrical component (10) e.g. power semiconductor module substrate, comprising a circuit structured metal layer (14). A composite film (12) comprises an electrically insulating film (18) i.e. polyimide film, between a logic metal layer (22) i.e. copper layer, and a power metal layer (20) i.e. aluminum layer. The power metal layer and the insulating film are formed with a recess (24), and the logic metal layer is pressed through the recess and connected with the circuit structured metal layer in an electrically conductive manner.