发明名称 Method of manufacturing MEMS device
摘要 A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to an outside, on a substrate; and performing surface etching for the MEMS structure in a gas phase by supplying an etching gas to the periphery of the MEMS structure from the outside.
申请公布号 US8026120(B2) 申请公布日期 2011.09.27
申请号 US20100684248 申请日期 2010.01.08
申请人 SEIKO EPSON CORPORATION 发明人 KIHARA RYUJI;INABA SHOGO
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
主权项
地址