发明名称 Aluminum-silicon carbide composite and heat dissipation device employing the same
摘要 An aluminum-silicon carbide composite suitable for a base plate for power module, having an aluminum-silicon carbide composite, with a front and a rear surface plane, that is a flat plate-shaped silicon carbide porous body impregnated with a metal mainly containing aluminum, and an aluminum layer made of a metal mainly containing aluminum formed only on the front surface plane, wherein the rear surface plane of the composite is exposed to the outside, and the shape of the exposed aluminum-silicon carbide composite is rectangular, optionally having peripheral portions encompassing holes removed. Plating is imparted to the composite by providing an aluminum layer on the rear surface plane. Flatness of the composite is improved by grinding its rear surface so that the composite is exposed to the outside. Warpage after grinding the rear surface, is controlled by controlling the thickness of the aluminum layer.
申请公布号 US8025962(B2) 申请公布日期 2011.09.27
申请号 US20060095005 申请日期 2006.11.13
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 HIROTSURU HIDEKI;IWAMOTO GOH;TSUKAMOTO HIDEO;MIYAI AKIRA;SASAKI YOSHIO
分类号 B32B3/26;B32B15/00 主分类号 B32B3/26
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