发明名称 |
Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another |
摘要 |
A microelectronic assembly including a first and second microelectronic elements. Each of the microelectronic elements have oppositely-facing first and second surfaces and edges bounding the surfaces. The first microelectronic element is disposed on the second microelectronic element with the second surface of the first microelectronic element facing toward the first surface of the second microelectronic element. The first microelectronic element preferably extends beyond at least one edge of the second microelectronic element and the second microelectronic element preferably extends beyond at least one edge of the first microelectronic element.
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申请公布号 |
US8026611(B2) |
申请公布日期 |
2011.09.27 |
申请号 |
US20050291398 |
申请日期 |
2005.12.01 |
申请人 |
TESSERA, INC. |
发明人 |
MOHAMMED ILYAS;HABA BELGACEM |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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