There is provided a wiring board. The wiring board includes: a semiconductor substrate having a through hole and covered with an insulating film; a through electrode formed in the through hole; a first wiring connected to one end of the through electrode; and a second wiring connected to the other end of the through electrode. The semiconductor substrate includes: a semiconductor element and a first guard ring formed to surround the through hole. The semiconductor element includes a first conductivity-type impurity diffusion layer having a different conductivity-type from that of the semiconductor substrate and is electrically connected to the first wiring and the second wiring.
申请公布号
US8026576(B2)
申请公布日期
2011.09.27
申请号
US20080241238
申请日期
2008.09.30
申请人
SHINKO ELECTRIC INDUSTRIES CO., LTD.;ASAHI KASEI MICRODEVICES CORPORATION