发明名称 |
Baked resin product and electronic device comprising the same |
摘要 |
The present invention provides a baked resin product that exhibits an excellent heat resistance and an electronic device that incorporates this baked resin product. The present invention provides a baked resin product obtained by baking a resin composition that contains a main chain-type aromatic benzoxazine structure, wherein the baked resin product has a peak measured by 13C-NMR at 58±2 ppm and a half width of this peak of 4 to 10 ppm. The present invention also provides a method of producing a baked resin product, comprising baking a resin composition that contains a main chain-type aromatic benzoxazine structure at 270° C. to 350° C. The present invention further provides an electronic device that incorporates this baked resin product.
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申请公布号 |
US8026335(B2) |
申请公布日期 |
2011.09.27 |
申请号 |
US20070299245 |
申请日期 |
2007.05.01 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
CHIKU YOSHINORI;EGUCHI YUJI;DOYAMA KAZUO |
分类号 |
C08G65/10 |
主分类号 |
C08G65/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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