发明名称 |
Semiconductor chip module with stacked flip-chip unit |
摘要 |
A semiconductor chip module includes a first flip-chip unit and a second flip-chip unit. The first flip-chip unit has a first chip and a first glass circuit board. The first chip is connected with the first glass circuit board by flip-chip bonding. The second flip-chip unit has a second chip and a second glass circuit board. The second chip is connected with the second glass circuit board by flip-chip bonding. The first flip-chip unit and the second flip-chip unit are attached to each other. A method for manufacturing the semiconductor chip module is also disclosed. |
申请公布号 |
US8026598(B2) |
申请公布日期 |
2011.09.27 |
申请号 |
US20090496244 |
申请日期 |
2009.07.01 |
申请人 |
GIGNO TECHNOLOGY CO., LTD. |
发明人 |
SAH WEN-JYH |
分类号 |
H01L25/065;H01L23/538 |
主分类号 |
H01L25/065 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|