发明名称 |
Integrated circuit package system with internal stacking module adhesive |
摘要 |
An integrated circuit package system comprising: providing a substrate; forming a base assembled package over the substrate; forming a top package over the base assemble package; and applying a top package stacking material for stand-off or insulation to the base assembled package and the top package.
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申请公布号 |
US8026582(B2) |
申请公布日期 |
2011.09.27 |
申请号 |
US20080025745 |
申请日期 |
2008.02.04 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
LEE MYUNG KIL;KIM JAE CHANG;LEE KOO HONG |
分类号 |
H01L23/053;H01L23/02;H01L23/52 |
主分类号 |
H01L23/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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