| 摘要 |
A wafer processing method of dividing a wafer into individual devices, the wafer having on a front surface a device area and an external circumferential redundant area surrounding the device area, the method including: a wafer grinding step in which, in the state where the wafer is held on the side of a protection tape stuck to the front surface of the wafer, a rear side of the device area in a rear surface of the wafer is ground to form a recessed portion to form a ringlike reinforcing portion on an outer circumferential side of the recessed portion; a metal film coating step for coating, with a metal film, a rear surface of the wafer stuck with the protection tape on the front surface; and a wafer dividing step for cutting the predetermined dividing lines from a rear surface side of the wafer stuck with the protection tape on the front surface, thereby dividing the wafer into the individual devices.
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