发明名称 Optical bonding composition for LED light source
摘要 Disclosed herein is an optical bonding composition that may be used in optical applications. An LED light source that utilizes the composition is also disclosed, as well as a method of making it. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising surface-modified metal oxide nanoparticles in an amorphous silicate network, the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.
申请公布号 US8026115(B2) 申请公布日期 2011.09.27
申请号 US20070514630 申请日期 2007.11.15
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 BARNES AMY S.;THOMPSON D. SCOTT;KOLB BRANT U.;BALLEN TODD A.;ROLF JACQUELINE C.;BROTT ROBERT L.
分类号 H01L21/00;C09D183/04;H01L33/00;H01L33/58 主分类号 H01L21/00
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