发明名称 |
ELECTRONIC DEVICE HAVING INTERCONNECTIONS AND PADS |
摘要 |
An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer.
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申请公布号 |
US2011227221(A1) |
申请公布日期 |
2011.09.22 |
申请号 |
US201113028836 |
申请日期 |
2011.02.16 |
申请人 |
PARK JI-YONG;LEE HEE-SEOK;KIM CHUL-WOO;JO SANG-GUI;BAE KWANG-JIN;KIM SEUNG-HWAN |
发明人 |
PARK JI-YONG;LEE HEE-SEOK;KIM CHUL-WOO;JO SANG-GUI;BAE KWANG-JIN;KIM SEUNG-HWAN |
分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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