| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic element built-in printed circuit board, and to provide a method for manufacturing the element. <P>SOLUTION: The electronic element built-in printed circuit board is a printed circuit board with a built-in passive element, wherein a pair of electrodes are formed at both end parts and includes a core substrate in which a first cavity is formed; a first passive element which is built in the first cavity and has a thickness thinner than the core substrate; a second passive element which is so laminated on the upper side of the first passive element as to be built in the first cavity. The first passive element and the second passive element are laminated, while crossing each other. <P>COPYRIGHT: (C)2011,JPO&INPIT |
