发明名称 |
HEATING APPARATUS AND ANNEALING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heating device capable of uniformly and efficiently heating LED devices. <P>SOLUTION: The heating device includes a metal heat dissipation substrate 72; an insulating layer 74 formed directly on the heat dissipation substrate; a plurality of wiring patterns 76 disposed on the insulating layer; and LED modules 54, having LED devices 70 disposed on the plurality of wiring patterns and metal wirings 82 for electrically and serially connecting between the LED devices that are adjacent to each other. This structure in which the insulating layer is formed directly on the heat dissipating substrate and the plurality of wiring patterns are formed thereon enables uniform and efficient heat dissipation of the LED devices. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011187752(A) |
申请公布日期 |
2011.09.22 |
申请号 |
JP20100052421 |
申请日期 |
2010.03.09 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
SUZUKI TOMOHIRO;OYA KAZUHIRO;YONEDA MASATAKE |
分类号 |
H01L21/26;C23C4/10;C23C14/50;C23C14/58;C23C16/46;H01L21/265;H01L33/64 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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