| 摘要 |
<P>PROBLEM TO BE SOLVED: To ensure reliability of a wire connection structure and to give versatility to the wire connection structure. <P>SOLUTION: At least a part of a relay member 100 is located between a semiconductor chip 20 and a lead 14 in plan view, and a plurality of metals are placed on the surface of the relay member 100 with the metals insulated from each other. At least one of other ends 44, 34 of a first wire 40 and a second wire 30 is joined to at least one of metals located on the surface of the relay member 100. Furthermore, other end 44 of the first wire 40 and other end 34 of the second wire 30 are joined to each other at a portion located between the semiconductor chip 20 and the lead 14 of the relay member 100. <P>COPYRIGHT: (C)2011,JPO&INPIT |
