| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition that has superior flame resistance and liquidity, and a semiconductor device using a cured body thereof. SOLUTION: The semiconductor sealing resin composition includes an epoxy resin (A), a curing agent (B) and an inorganic filler (C), and the epoxy resin (A) includes a compound (A1) having a structure represented by general formula (1), where Ar1 represents an aromatic hydrocarbon group having 6 to 14 carbons, Ar2 represents a benzene ring, R1 represents a hydrocarbon group having 1 to 6 carbons, R2 and R3 represent a hydrogen atom or a hydrocarbon group having 1 to 6 carbons, R4 represents a hydrocarbon group having 1 to 3 carbons, and they may be identical or different. Here, (a) is an integer of 1 to 3, (b) is an integer of 0 to 4, (c) is an integer of 0 to 4, (d) is an integer of 1 to 10, (e) is an integer of 1 to 10, and d×e ranges from 1 to 10. COPYRIGHT: (C)2011,JPO&INPIT |
