发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the performance of a semiconductor device by inhibiting the mixture of hydrogen into an oxide film formed on an exposed surface of a silicon-containing film, a dielectric film that has been already deposited on a substrate and the like. SOLUTION: A semiconductor device manufacturing method includes: a reduction process of supplying a reducing gas with a larger particle in molecular size than that of a hydrogen gas into a processing chamber and supplying a reducing gas plasma that is generated by plasma-discharging the reducing gas supplied into the processing chamber to the surface of the substrate; and an oxidization process of supplying an oxidizing gas into the processing chamber and supplying an oxidizing gas plasma that is generated by plasma-discharging the oxidizing gas supplied into the processing chamber to the surface of the substrate. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187749(A) 申请公布日期 2011.09.22
申请号 JP20100052390 申请日期 2010.03.09
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TSUBOTA YASUHISA
分类号 H01L21/8247;H01L21/316;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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