发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To improve the performance of a semiconductor device by inhibiting the mixture of hydrogen into an oxide film formed on an exposed surface of a silicon-containing film, a dielectric film that has been already deposited on a substrate and the like. SOLUTION: A semiconductor device manufacturing method includes: a reduction process of supplying a reducing gas with a larger particle in molecular size than that of a hydrogen gas into a processing chamber and supplying a reducing gas plasma that is generated by plasma-discharging the reducing gas supplied into the processing chamber to the surface of the substrate; and an oxidization process of supplying an oxidizing gas into the processing chamber and supplying an oxidizing gas plasma that is generated by plasma-discharging the oxidizing gas supplied into the processing chamber to the surface of the substrate. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011187749(A) |
申请公布日期 |
2011.09.22 |
申请号 |
JP20100052390 |
申请日期 |
2010.03.09 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
TSUBOTA YASUHISA |
分类号 |
H01L21/8247;H01L21/316;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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