发明名称 ARC ION PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an arc ion plating device in which an evaporation source is evenly consumed and the efficiency of use is improved by removing the local concentration and evenly moving an arc spot as a whole in the inner side area of an evaporation surface. SOLUTION: The magnetic flux density on the surface of the inner side area besides the edge part area of a predetermined width from the edge surface to the inner side of the evaporation source 5 is 7 to 10 mT, the magnetic flux density on the surface of the edge part area is larger than the magnetic flux density on the surface of the inner side area by 3 mT or more, the magnetic line on the evaporation surface 11 has an angleθwith respect to the normal of the evaporation surface, the angleθbeing larger than 0°and less than 20°, and is inclined to the inner side area on the surface of the edge part area, and the magnetic flux density of the inner side area has a standard deviation of three or less. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011184779(A) 申请公布日期 2011.09.22
申请号 JP20100053757 申请日期 2010.03.10
申请人 MITSUBISHI MATERIALS CORP 发明人 SENBOKUYA KAZUAKI;TANAKA YUSUKE
分类号 C23C14/32 主分类号 C23C14/32
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