| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element with further improved reliability and manufacturing yield, a semiconductor light-emitting device, and a manufacturing method for the semiconductor light-emitting element. <P>SOLUTION: The semiconductor light-emitting element includes a support substrate 70; a junction 40 provided on the support substrate 70 and having a first metal film 411; an intermediate metal film 50 provided on the junction 40 and having a larger linear expansion coefficient than that of the first metal film 411; a first electrode 30, provided on the intermediate metal film 50 and including a second metal film 320, having a linear expansion coefficient larger than that of the intermediate metal film 50; a semiconductor laminate 10 provided on the first electrode 30 and including a light-emitting portion 1; and a second electrode 20 provided on the semiconductor laminate 10. <P>COPYRIGHT: (C)2011,JPO&INPIT |
