| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method wherein damage on a piezoelectric element can be prevented when the piezoelectric element is pressed against adhesive applied onto a substrate for bonding. <P>SOLUTION: The bonding method of piezoelectric element where a ceramic piezoelectric element 3 is bonded to a substrate 1 with adhesive 2 having thixotropy includes a coating step for applying the adhesive 2 onto the surface of the substrate 1, a temporary mounting step for sucking the piezoelectric element 3 by means of a suction head in which a suction hole 81a is formed and then mounting the piezoelectric element 3 on the adhesive 2 thus coated, a pressing step for pressing the piezoelectric element 3 by means of a press head 82 having a planar pressing surface 82a, and a curing step for curing the adhesive 2. Since an excessive stress does not act on the piezoelectric element 3 which is pressed by the planar pressing surface 82a, damage on the piezoelectric element 3 can be prevented. <P>COPYRIGHT: (C)2011,JPO&INPIT |
