| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problem: when an electronic component is mounted by soldering on a printed wiring board, a defect such as a short circuit in the printed wiring board, which is caused due to sticking of residues of flux on an unsoldered part, occurs. SOLUTION: A pallet 1 for soldering is adapted to solder the electronic component to the predetermined part of the printed wiring board, is made of a heat-resistant resin material, and has glass fiber exposed at least at a part 6 that flux sticks on. Since this configuration greatly reduces residues of the flux of the pallet 1 for soldering, defects of a printed wiring board device caused by foreign matter such as dust sticking on the pallet 1 for soldering are greatly reduced. COPYRIGHT: (C)2011,JPO&INPIT |
