发明名称 |
SYSTEM AND METHOD FOR CUTTING SUBSTRATE INTO WORKPIECES |
摘要 |
A computer obtains user input from an input to control a cutter and a conveyor to cut a substrate. The control module of the computer calculates a total number of cuts of the substrate and a distance that the substrate moves before each cut of the substrate according to user input. A conveyer control module of the computer controls the conveyer to move the substrate, where a reminder signal is sent out after the substrate has moved the distance. A cutter control module of the computer controls the cutter to cut the substrate.
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申请公布号 |
US2011230997(A1) |
申请公布日期 |
2011.09.22 |
申请号 |
US20100914971 |
申请日期 |
2010.10.28 |
申请人 |
HONG HENG SHENG ELECTRONICAL TECHNOLOGY (HUAIAN) CO.,LTD;FOXCONN ADVANCED TECHNOLOGY INC. |
发明人 |
WU XIAO-BIN |
分类号 |
G06F17/00 |
主分类号 |
G06F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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