发明名称 SYSTEM AND METHOD FOR CUTTING SUBSTRATE INTO WORKPIECES
摘要 A computer obtains user input from an input to control a cutter and a conveyor to cut a substrate. The control module of the computer calculates a total number of cuts of the substrate and a distance that the substrate moves before each cut of the substrate according to user input. A conveyer control module of the computer controls the conveyer to move the substrate, where a reminder signal is sent out after the substrate has moved the distance. A cutter control module of the computer controls the cutter to cut the substrate.
申请公布号 US2011230997(A1) 申请公布日期 2011.09.22
申请号 US20100914971 申请日期 2010.10.28
申请人 HONG HENG SHENG ELECTRONICAL TECHNOLOGY (HUAIAN) CO.,LTD;FOXCONN ADVANCED TECHNOLOGY INC. 发明人 WU XIAO-BIN
分类号 G06F17/00 主分类号 G06F17/00
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