CURABLE COMPOSITION, DICING-DIE BONDING TAPE, CONNECTING STRUCTURE AND METHOD FOR PRODUCING SEMICONDUCTOR TAPE WITH COHESIVE/ADHESIVE LAYER

摘要

Disclosed is a curable composition having superior adhesive properties for cured material after curing. This curable composition comprises an epoxy resin, curing agent for epoxy resin, a first acrylic resin containing an epoxy group and having a weight-average molecular weight of 100,000 - 400,000 and a glass transition temperature of 60°C or higher, a second acrylic resin containing an epoxy group and having a weight-average molecular weight of 10,000 - 20,000 and a glass transition temperature of 60°C or higher and a nanofiller. In the total of 100 wt% for the epoxy resin, first acrylic resin containing an epoxy group and second acrylic resin containing an epoxy group, the content for the first acrylic resin containing an epoxy group is 10 - 40 wt%, and the content for the second acrylic resin containing an epoxy group is 1 - 35 wt%.