发明名称 EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, AND ADHESIVE AGENT FOR LAMINATE
摘要 <p>Disclosed are: an epoxy resin curing agent that, in addition to the excellent performance and high gas barrier performance of epoxy resins, grants favorable adhesive qualities to polyester; an epoxy resin composition containing said epoxy resin curing agent; an adhesive agent that is for a laminate and that has said composition has the primary component; and a laminate film, multi-layered packaging material, and a bag for packaging that use said adhesive agent. The epoxy resin curing agent is characterized by being a reaction product of the belowmentioned A, B, and C: (A) metaxylylene diamine or a paraxylylene diamine; (B) a polyfunctional compound that has one acyl group, can form an oligomer, and forms an amide group site by means of a reaction with a polyamine; and (C) an aromatic dicarboxylic acid, an ester thereof, a amide, an acid anhydride, or an acid chloride.</p>
申请公布号 WO2011115020(A1) 申请公布日期 2011.09.22
申请号 WO2011JP55833 申请日期 2011.03.11
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC.;KUMAMOTO, KANA;HONDA, EIICHI 发明人 KUMAMOTO, KANA;HONDA, EIICHI
分类号 C08G59/54;B32B27/00;B65D65/40;C09J11/06;C09J163/00 主分类号 C08G59/54
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