| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve electrical conductivity and thermal conductivity of through electrodes 6 formed in an insulating substrate. <P>SOLUTION: An electronic device 1 includes the insulating substrate 2 which has a hollow 4 in a surface and also has through holes 3 formed penetrating from a bottom surface of the hollow 4 to a reverse surface, the through electrodes 6 formed by heat-treating metal paste charged in the through holes 3 and comprising a mixture of nano-metal particles and a conductive filler having an average particle diameter of ≤10 μm, an electronic component 7 stored in the hollow 4 and electrically connected to the through electrodes 6, and a sealing portion 9 adapted to seal the electronic component 7. The electrical conductivity and thermal conductivity of the through electrodes 6 are improved. <P>COPYRIGHT: (C)2011,JPO&INPIT |
