发明名称 MATERIAL CONVEYING SYSTEM FOR CUTTING BASE MATERIAL, AND METHOD FOR CUTTING BASE MATERIAL IN MATERIAL CONVEYING SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a material conveying system including a conveying belt having resistance to a damage by laser radiation. <P>SOLUTION: The conveying system includes: the conveying belt 102 extended between at least a first roller and a second roller; and at least one laser cutting system 400. The conveying belt 102 includes at least a first layer and a second layer. The first layer has an inner surface and the second layer has an outer surface 108 including a material selected from a group of copper, a copper-base alloy, aluminum, an aluminum-base alloy and nickel. The laser cutting system 400 directs a base material to the outer surface of the conveying belt 102, emits the laser radiation and includes an operable laser so as to cut at least one base material 414 supported by the outer surface 108. The second layer of the conveying belt 102 has resistance to dissolution during cutting of the base material 414. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011183457(A) 申请公布日期 2011.09.22
申请号 JP20110045918 申请日期 2011.03.03
申请人 XEROX CORP 发明人 ANDREWS JOHN R;SCARLATA RICHARD F;ROBINSON PAUL K
分类号 B23K26/38;B23K26/42 主分类号 B23K26/38
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