发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a fine pattern by photolithography and forming an insulating film without performing heat treatment at >200&deg;C and having no problem that a carrier is trapped and the degree of charge transfer is reduced when used as a gate insulating film of an organic thin film transistor. <P>SOLUTION: The photosensitive resin composition contains a polysiloxane compound having a unit represented by general formulae (1) to (4) and a photo radical generator. In the formula (1), R<SP>1</SP>denotes a hydrogen atom or a methyl group and R<SP>2</SP>denotes a 1-5C alkylene group which may have a substituted alkyl group. In the formula (2), R<SP>3</SP>denotes a hydrogen atom or a 1-4C alkyl group. In the formula (3), R<SP>4</SP>denotes a 1-6C alkyl group or a 5 or 6C cycloalkyl group. In the formula (4), R<SP>5</SP>denotes a hydrogen atom or a 1-4C alkyl group. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011186069(A) 申请公布日期 2011.09.22
申请号 JP20100049437 申请日期 2010.03.05
申请人 ADEKA CORP 发明人 HARA KENJI
分类号 G03F7/075;C08F299/08;C08G77/14;H01L29/786;H01L51/05;H01L51/30 主分类号 G03F7/075
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