发明名称 ELECTROLESS TIN PLATING SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide a method for enhancing the productivity of products by shortening the heat treatment time for preventing generation of a whisker of a tin plating film. SOLUTION: Electroless tin plating solution contains soluble tin salt, complexing agent and acid, but contains no chromium, manganese, iron, aluminum, vanadium, zirconium and molybdenum. The electroless tin plating solution further contains malic acid of 5-200 g/L as at least one component of the acid while anion part of alkane sulfonic acid and anion part of alkanol sulfonic acid are not coexistent. In a method for manufacturing a plated object having a tin plating film formed on copper, an object to be plated having copper at least on its surface is immersed in the electroless tin plating solution, then subjected to the heat treatment for 45-90 minutes at a temperature of 110-130°C, and the thickness of a pure tin layer in the obtained tin plating film is controlled to 0.100-0.250μm. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011184745(A) 申请公布日期 2011.09.22
申请号 JP20100051873 申请日期 2010.03.09
申请人 JX NIPPON MINING & METALS CORP 发明人 KOBAYASHI HIRONORI;NANBA RUI;YABE JUNJI
分类号 C23C18/31;C23C18/16 主分类号 C23C18/31
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