SHEET CUTTING METHOD AND SHEET CUTTING DEVICE

摘要

By cutting an adhesive sheet (S) by moving a cutter blade (72) while rotating said cutter blade (72) so that the blade tip follows the inclinations (K1, K2) and valley (K3) of a notch (K), uncut portions of the adhesive sheet (S) on the notch (K) can be eliminated or minimized. During a subsequent rear surface grinding step or the like, the disclosed sheet cutting method and sheet cutting device can prevent damage to a wafer (W) due to the uncut portion of the adhesive sheet (S) being stuck between the wafer (W) and a grinding blade, and can also prevent washing water from entering when the uncut portion of the adhesive sheet (S) peels off.