| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows each constituent element, such as, a signal pin to be simply and assembled without fail to a corresponding target component such as a circuit board, without causing unnecessary deformations, or the like, while eliminating soldering when assembling a functional apparatus such as a power module to a circuit board, such as, a control circuit board. <P>SOLUTION: A press-fit terminal 71 electrically connects between a power module 50 and a circuit board 80, and the press-fit terminal is press-fitted to an insertion part 56 of the power module so as to assemble the power module to the circuit board. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
