| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To secure electromagnetic shield properties by suppressing space leakage of electromagnetic waves in a module. <P>SOLUTION: A high frequency module is constituted by including a multilayer package constituted by a multilayer substrate housing a semiconductor element and a multilayer mother board to which the multilayer package is connected via a ball grid array. The multilayer package is provided with a vertical power supply via connected to the semiconductor element. The ball grid array has a signal bump whose periphery is surrounded by the grounded bump. The multilayer mother board is provided with the vertical power supply via connected to the signal bump of the ball grid array, and a triplate line connected to the vertical power supply via. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
