| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition for electronic component encapsulation, suppressing warpage of electronic component devices encapsulated with a resin based on both of a linear expansion coefficient and a glass transition temperature, and excellent in heat resistance, and to provide electronic component devices using the composition. <P>SOLUTION: There is provided a resin composition for electronic component encapsulation, including the following ingredients A-C. Further, there are provided electronic component devices using the resin composition for electronic component encapsulation. A: a cyanate ester resin; B: at least one selected from among a phenol resin, a melamine compound and an epoxy resin; and C: an inorganic filler. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
