发明名称 DETERGENT COMPOSITION FOR CUTTING OBJECTS
摘要 PROBLEM TO BE SOLVED: To provide a neutral detergent composition which shows excellent detergency to the removal of stains in an extremely narrow gap required for a silicon wafer manufacturing process or the like, reduces the amount of a metal residue on the surface of an object to be cleaned after cleaning, has less deterioration of a cleaning liquid by bringing in the object to be cleaned, and also has less effects on human bodies and environment. SOLUTION: A detergent composition comprises: (a) an ether type nonionic surfactant of 0.3 to 3 pts.wt. represented by general formula (1): R-O-(AO)n-H; (b) at least one sequestering agent (chelating agent) of 0.005 to 1 pt.wt. selected from a group of sugar alcohol, an aliphatic oxycarboxylic acid or salts thereof, and a polycarboxylic acid or salts thereof; and (c) water (the balance of 100 pts.wt. of the total amount of (a) and (b)). In general formula (1), R represents a 8-24C straight-chain or branched-chain aliphatic hydrocarbon group; AO represents a 2-4C oxyalkylene group; and n represents an average added mole number of an oxyalkylene group, and is 1 to 100. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187714(A) 申请公布日期 2011.09.22
申请号 JP20100051880 申请日期 2010.03.09
申请人 DAI ICHI KOGYO SEIYAKU CO LTD 发明人 NAKAGAWA KAZUNORI;KIKAZAWA SHIGERU;NABESHIMA TOSHIICHI
分类号 H01L21/304;B28D7/02 主分类号 H01L21/304
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