| 发明名称 |
ELECTROLESS PLATING PRETREATMENT AGENT |
| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating pretreatment agent having excellent plating properties to a through hole. SOLUTION: The electroless plating pretreatment agent contains one or more imidazole alcohol compounds represented by general formulae (1) and (2) and a palladium compound. COPYRIGHT: (C)2011,JPO&INPIT
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| 申请公布号 |
JP2011184728(A) |
申请公布日期 |
2011.09.22 |
| 申请号 |
JP20100050160 |
申请日期 |
2010.03.08 |
| 申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
MURAKAMI TATSU;SUZUKI JUN;KAWAMURA HISAFUMI;IMORI TORU |
| 分类号 |
C23C18/18;C23C18/30;H01L21/28;H01L21/288;H05K3/18;H05K3/42 |
主分类号 |
C23C18/18 |
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