发明名称 MEMS ELEMENT, AND MANUFACTURING METHOD OF MEMS ELEMENT
摘要 <p>In a MEMS element having a substrate (1), a sealing membrane (7), a movable portion (3) and an electrode (5) of a beam-like structure having mutually overlapping areas separated by a gap in a direction perpendicular to the surface of the substrate (1), and first and second cavities formed separated by the electrode (5) between the substrate (1) and the sealing membrane (7); wherein a cavity on the side of the movable portion (3) in a direction perpendicular to the substrate surface is assumed to be a first cavity (9) and another cavity is assumed to be a second cavity, an inner side surface (a) of a side wall (A) in contact with the electrode (5) of the first cavity (9) is disposed so as to be more inside, in a direction parallel to the substrate surface, than an inner side surface (b) in contact with the electrode (5) of a side wall (B) of the second cavity (10), so that even if mechanical stress is applied from the outer side of the sealing membrane (7), the movable portion (3) and the electrode (5) do not collide.</p>
申请公布号 WO2011114628(A1) 申请公布日期 2011.09.22
申请号 WO2011JP01051 申请日期 2011.02.24
申请人 PANASONIC CORPORATION;IWASAKI, TOMOHIRO;ONISHI, KEIJI;NAKAMURA, KUNIHIKO 发明人 IWASAKI, TOMOHIRO;ONISHI, KEIJI;NAKAMURA, KUNIHIKO
分类号 H03H9/24;B81B3/00;B81C1/00;H01L29/84;H03H3/007;H03H9/02 主分类号 H03H9/24
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