发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide conductive paste excelling in electrical conductivity and adhesion, while being capable of low-temperature curing at 60°C or below. SOLUTION: The conductive paste includes conductive particles, epoxy resin, a curing agent and a plasticizer. The conductive particle is a silver particle, the epoxy resin is trifunctional epoxy resin, the curing agent is an amine curing agent, and the plasticizer is an epoxidized polybutadiene; and the conductive paste includes 85 to 95 mass% conductive particles, and the conductive particles are scale-like silver powder conductive particles desirably having an average particle diameter range of 1 to 30μm. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187194(A) 申请公布日期 2011.09.22
申请号 JP20100048620 申请日期 2010.03.05
申请人 SUMITOMO BAKELITE CO LTD 发明人 TAGASHIRA NOBUO
分类号 H01B1/22;H01B1/00;H05K1/09;H05K3/12 主分类号 H01B1/22
代理机构 代理人
主权项
地址