| 摘要 |
A heat exchanger useful for mounting to an electronic component housing or other system requiring heat exchange. The heat exchanger has a manifold having a cross-sectional configured for providing an unequal coolant flow to an array of cooling channels fed by the manifold, thereby providing for preferential amounts of heat exchange over a given heat exchange surface of the heat exchanger. A safety channel may surround the channels carrying the coolant to prevent potential leakage outside of the heat exchanger. |
