BOTTOM ELECTRODES FOR USE WITH METAL OXIDE RESISTIVITY SWITCHING LAYERS
摘要
<p>A MIM stack (200a) is provided that includes (1) a first conductive layer (108) comprising a first metal - silicide layer (108a) and a second metal - silicide layer (108b); (2) a resistivity- switching layer (104) comprising a metal oxide layer formed above the first conductive layer; and (3) a second conductive layer (106) formed above the resistivity- switching layer. A memory cell may be formed from the MIM stack. Numerous other aspects are provided.</p>
申请公布号
WO2011115926(A1)
申请公布日期
2011.09.22
申请号
WO2011US28396
申请日期
2011.03.14
申请人
SANDISK 3D, LLC;SEKAR, DEEPAK, CHANDRA;KREUPL, FRANZ;MAKALA, RAGHUVEER, S.
发明人
SEKAR, DEEPAK, CHANDRA;KREUPL, FRANZ;MAKALA, RAGHUVEER, S.