| 摘要 |
<p>Provided is a two-layer flexible substrate, in particular, a two-layer flexible substrate suitable for fine-pattern formation or COF mounting, which not only has no pinholes of a thin copper film layer or a copper layer that are due to pinholes generated when an undercoat metal layer was formed on an insulator film by dry plating, but also has few pinholes of the undercoat metal layer, and which has excellent adhesion between the insulator film and the undercoat metal layer and excellent corrosion resistance and water resistance. Also provided is a process for producing the two-layer flexible substrate. The two-layer flexible substrate is obtained by forming an undercoat metal layer by dry plating on at least one surface of an insulator film without through any adhesive and forming a thin copper film layer and/or a copper layer on the undercoat metal layer by dry plating. The insulator film had undergone a surface treatment, and the insulator film after the surface treatment had an oligomer amount that was up to 70% of the oligomer amount of the insulator film which had not undergone the surface treatment.</p> |
