| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve packaging of a solid-state light-emitting die. <P>SOLUTION: A preform is attached to the solid-state light-emitting die. One or more optical elements such as a photoluminescent element, refracting element, filter element, scattering element, diffusion element or reflecting element, is included in and/or on the preform. For example, the preform may be of a glass preform with phosphor particles suspended therein. The preform may be fabricated using a microelectonic manufacturing techniques, and may be placed on the solid state light emitting die using pick and place techniques. <P>COPYRIGHT: (C)2011,JPO&INPIT |
