发明名称 MOUNTING STRUCTURE OF FLEXIBLE BOARD, MOUNTING METHOD OF FLEXIBLE BOARD, DROPLET DISCHARGE HEAD, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To reliably inexpensively joint a terminal part of a flexible board to an electrode of a connection component to be electrically conductive by using an insulating resin. SOLUTION: A joint surface 512a facing one surface 80a of an upper electrode film (electrode) 80 in a terminal part 512 of a flexible board 500 includes a flat part 513 expanding nearly in parallel to the one surface 80a of the upper electrode film 80 and stuck to the upper electrode film 80 through a joint material layer 85. On the joint surface 512a, a projecting part 514 formed adjacent to the flat part 513, projecting toward the one surface 80a of the upper electrode film 80 from the flat part 513, and directly contacting the one surface 80a of the upper electrode film 80 without interposing the joint material layer 85 is provided. By the projecting part 514, a wiring pattern (conductive part) 510 formed on the undersurface 500A of the flexible board 500 is electrically connected to the upper electrode film (electrode) 80. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187788(A) 申请公布日期 2011.09.22
申请号 JP20100052814 申请日期 2010.03.10
申请人 SEIKO EPSON CORP 发明人 KORI TOSHIAKI
分类号 H05K1/14;B41J2/045;B41J2/055;B41J2/16;H05K3/28;H05K3/36 主分类号 H05K1/14
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