| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit module that improves the strength of bonding a mother board and the like to a wiring board. SOLUTION: The electronic circuit module has such a configuration that: there is disposed an insulating substrate 1; an electronic circuit 3 is formed by allowing one or a plurality of electronic components to be mounted on an upper surface 11 and/or lower surface 12 of the insulating substrate 1; a lower surface electrode 41 is formed on a region different from a forming region of the electronic circuit 3 on the lower surface 12 of the insulating substrate 1; and the lower surface electrode 41 and an electronic circuit 4 are electrically connected to each other. In the electronic circuit module, a second insulating substrate 2 is disposed on a side of the lower surface 12 of the insulating substrate 1. An upper surface electrode 51 and lower surface electrode 52 which are electrically connected to each other are formed on an upper surface 21 and lower surface 22 of the second insulating substrate 2. Further, the lower surface electrode 41 of the insulating substrate 1 on which the electronic circuit 3 is formed is electrically bonded by a bonding member 71 having electric conductivity on the upper surface electrode 51 of the second insulating substrate 2. COPYRIGHT: (C)2011,JPO&INPIT
|
