发明名称 METHOD AND APPARATUS FOR UNSEALING PLASTIC MOLDED SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and method of unsealing a plastic mold, unsealing the plastic mold by spraying the plastic mold with a chemical without vaporizing it. SOLUTION: The apparatus for unsealing the plastic mold to spray a sample molded of plastic with a chemical for melting and unsealing, is equipped with: a chemical supply proportioning pump for supplying the chemical; an inert gas supply proportioning pump for supplying an inert gas; a pipe for mixing the chemical with the inert gas inside it; and a chemical spray part for spraying the sample with the chemical mixed with the inert gas in the pipe. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187517(A) 申请公布日期 2011.09.22
申请号 JP20100048594 申请日期 2010.03.05
申请人 NIPPON SCIENTIFIC CO LTD 发明人 GOTO HIDEO
分类号 H01L21/56;B29C37/02 主分类号 H01L21/56
代理机构 代理人
主权项
地址