发明名称 |
STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor package includes a set of stud bumps, which can be formed by wire bonding technology and can be bonded or joined to a semiconductor element to form a stacked package assembly. Since the process of bonding the semiconductor element to the stud bumps can be carried out without reflow, an undesirable deformation resulting from high temperatures can be controlled or reduced.
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申请公布号 |
US2011227220(A1) |
申请公布日期 |
2011.09.22 |
申请号 |
US20100874144 |
申请日期 |
2010.09.01 |
申请人 |
CHEN CHIA-CHING;DING YI-CHUAN |
发明人 |
CHEN CHIA-CHING;DING YI-CHUAN |
分类号 |
H01L23/48;H01L21/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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