| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, which mounts a semiconductor element on one surface of a wiring board and provides a thermally conductive member on the other surface of the board, capable of suitably dissipating heat without providing a perforated hole in a region of the wiring board for mounting the semiconductor element and independent of the thickness of the wiring board. SOLUTION: In the semiconductor device, in a region of the wiring board 20 for mounting the semiconductor element 10, a recessed portion 23 recessed from the other surface of the wiring board 20 is formed, and a region at the side of one surface of the wiring board 20 located at the bottom side of the recessed portion 23 is formed as a thin portion 24. Then a thermally conductive member 30 is inserted and disposed in the recessed portion 23 so that heat generated in the semiconductor element 10 may be conducted to the member 30 via the portion 24, and a part of the member 30 is exposed outside. COPYRIGHT: (C)2011,JPO&INPIT |
